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US-UK Resistive Switching Team

 

Our team has a wide range of expertise in thin film growth, materials characterisation, and devices fabrication/testing.

Growth Capabilities Electrical characterization Spectroscopy Surface imaging Microscopy Device Fabrication
PLD, Sputtering, ALD DC, RF, ferroelectric testing, impedance measurements Nanoplasmonic optical spectroscopy, environemntal XPS, in-situ XPS, synhcrotron based XAFS AFM, CAFM,  PFM STEM, nano-focused X-ray imaging  (diffraction, XAFS) Sputtering, evaporation, lithorgraphy

Growth

Pulsed Laser Deposition, among other growth techniques is performed in the Driscoll and Wang group labs. 

  

Materials Characterisation 

Various materials characteristion techniques are utulised within our team. Including: 

X-ray Photoelectron Specroscopy (XPS) - in ultra high vacuum or near-ambient pressure for in-situ XPS  

High resolution X-ray diffraction (HRXRD) and synchrotron-based diffraction/spectrocospy

Atomic Force Microscopy (AFM) and Conductive AFM

Scanning Transmission Electron Microscopy (STEM), Energy-dispersive electron specroscopy (EDS)

Nanoplasmonic optical specroscopy   

Device Fabrication and Testing

Resistive switching devices are fabricated in our team usin sputtering, evaporation, and photo/e-beam lithography. 

Electrical characterisation is performed for device testing incuding: DC, RF, and ferroelectric testing, as well as thin film impedance measurements, and piezo force microscopy (PFM)